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Advanced Metallization Conference 2008:18th Asian Session
South Asia | Japan | Tokyo
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| Sanjo Conferene Hall |
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| Opening date: |
OCT 08, 2008 |
Closing date: |
OCT 10, 2008 |
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| Registration period: |
OCT 08, 2008 |
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| Advanced Metallization Conference 2008, 18th Asian Session: ADMETA 2008 will be held from October 8 to 10, 2008. The conference is organized to stimulate and enhance the research and development of ULSI interconnect technology; and each year since 1989 the conference has been held at about the same time in both Japan and USA, and has showcased remarkable interconnect technology development in Asia. Current active development of Cu multilayer wiring technology is aimed at feature sizes of less than 50nm. Securing good reliability between barrier metal and low k in Low k/Cu wiring schemes has become an important topic. In addition, the application of Cu wiring has been broadened to the memory market and is widely used for Flash and DRAM. Moreover, there is advancement in the introduction of metal deposition for transistor surroundings such as for Silicide and Metal Gate, etc. The progress of miniaturization technology for packaging is rapid, and concepts for integrated wiring technology between Si chips and mounting substrates are requested. Contributions of papers are highly solicited addressing these topics, and related areas such as materials, interconnect design, reliability, equipment, and cost reduction, etc. where there is no shortage of problems to be solved. In addition to the main conference, from this year a new workshop and special session will be held to address the problems of future interconnect technology. Each year the workshop will have the theme “Next Generation Interconnects”. Each year a new theme will be picked for the special session, and this year’s theme is “Reliability” |
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| Topic : |
Tecnología |
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| Type : |
Conferencias |
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| Topics : |
- Metallization
- Interconnect & Dielectric Materials
- Materials Science of Thin Films, Surfaces and Interfaces
- Reliability Science and Failure Analysis
- Planarization Technology
- Deposition Technology
- Processing Science and Modeling
- Characterization
- Process Integration Issues
- Advanced Structures and Scaling Issues
- System in a Package |
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| This event is uploaded by: |
Dominioni, Cecilia |
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| Event's Web Site: |
http://www.admeta.org/
fontem recommends you consult the event web in order to be sure there has been no last minute changes in the organization |
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| Eventos similares: |
2013 International Joint Conference on Artificial Intelligence (IJCAI-13)(BEIJING, China)
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